- Films
- Thermoplastic Polyurethanes
Desmomelt® U 230
Aliphatic high-molecular-weight polyester-polyurethane adhesive raw material. Desmomelt® U 230 is a solid raw material for the formulation of non-yellowing, thermally activated adhesives. Desmomelt® U 230 is particularly well suited for applications with low thermal activation temperatures as e.g. in automotive trim, textile, footwear and furniture applications. Desmomelt® U 230 can be used as a hotmelt applied as a filament, foil or powder, as well as a raw material for non-yellowing solvent-based contact and/or heat activated adhesives. .
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About
Product Types
- PU films
- Polyurethane
- TPU
Material
- Adhesives
- Heat activated, Fast bonding, Solventborne, Moisture resistant, Heat resistant, Solid, Solvent-free, Contact adhesive, Foam bonding, Hot-melt
- Films
- Translucent, Printable, Hot and cold forming, Thermoformable, Flexible, Weather resistant, Tear resistant
- Thermoplastic Polyurethanes
- Wear resistant, Weather resistant, Cold-flexibility, Color stable, Thermoplasticity
General Characterization
Aliphatic high-molecular-weight polyester-polyurethane adhesive raw material.
Desmomelt® U 230 is a solid raw material for the formulation of non-yellowing, thermally activated adhesives. Desmomelt® U 230 is particularly well suited for applications with low thermal activation temperatures as e.g. in automotive trim, textile, footwear and furniture applications. Desmomelt® U 230 can be used as a hotmelt applied as a filament, foil or powder, as well as a raw material for non-yellowing solvent-based contact and/or heat activated adhesives.
Desmomelt® U 230 is a solid raw material for the formulation of non-yellowing, thermally activated adhesives. Desmomelt® U 230 is particularly well suited for applications with low thermal activation temperatures as e.g. in automotive trim, textile, footwear and furniture applications. Desmomelt® U 230 can be used as a hotmelt applied as a filament, foil or powder, as well as a raw material for non-yellowing solvent-based contact and/or heat activated adhesives.
Storage Conditions
Recommended storage temperatures: Temperatures higher than 30 °C should be avoided. Temperatures above 45 °C will lead to caking.
Protect from direct sunlight, heat, moisture and foreign material.
Protect from direct sunlight, heat, moisture and foreign material.
Sampling
No data available
Packaging Type
No data available
Technical Properties & Datasheets
Characteristics
| Property Name | Test Method | Unit | Value |
|---|---|---|---|
| Density | ISO 1183 | g/cm^3 | approx. 1.2 |
| Heat resistance | °C | approx. 60 | |
| Recommended processing temperature for automated application | °C | 240 - 280 | |
| Minimum activation temperature | DIN EN 12961 | °C | 60 - 70 |
| Minimum extrusion temperature | °C | 150 | |
| Hot tack life (Depends on application conditions) | min | 3 - 6 |
Specifications
| Property Name | Test Method | Unit | Value |
|---|---|---|---|
| Solution viscosity 15 w% in butanone-2 (MEK) / water (16:1 w/w) at 23°, (30 rpm) | M001 | mPa*s | approx. 300 |
Downloads
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Technical Data Sheet
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Safety Data SheetNo direct download available, please visit www.productsafetyfirst.covestro.com
