Hot-melt adhesives are applied at high temperatures and rapidly develop a considerable bond strength.
Processing technology

Hot-melt adhesive systems with rapid bond strength

Hot-melt adhesives (non-reactive or reactive) are solid at room temperature and liquefy when heated. They are applied at high temperatures and during the cooling process they solidify and crystallize to produce an adhesive bond which rapidly develops considerable bond strength. In the case of reactive polyurethane hot-melt adhesives, chemical bonds are additionally formed.
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Common raw materials for reactive PU hot melts are Desmodur® MDI grades, Baycoll® polyesters, Desmophen® polyesters and Desmophen® polyethers.  
Typical applications include adhesives for wood and furniture, automotive and transportation solutions, bookbinding, textiles, footwear and electronics.

Desmomelt® U is a new class of aliphatic, non-yellowing thermoplastic resin powders designed for adhesive applications where high (initial/final) bond strength and non-yellowing is mandatory.

With our Dureflex®, Platilon® and Pontacol® grades, we offer a range of hot melt films with versatile properties. Especially for applications that require good resistance to chemicals and tearing, while offering high flexibility, mechanical stability, and breathability paired with high production throughput, our adhesive films are an excellent choice.

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