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Our waterborne adhesive technology offers a low-emission approach to laminating and bonding. Waterborne solutions can meet or even exceed traditional solvent-based adhesive systems in terms of performance. Diverse formulating options are available which include polyurethane and polychloroprene dispersions as well as nano-silica dispersions and a variety of crosslinkers.

We offer polyurethane raw materials for waterborne and solventborne heat-activated adhesives. The adhesives are applied in the liquid stage. After drying the polymer film is typically tack-free at room temperature. At elevated temperatures, the molten polymer film is tacky and suitable for connecting substrates.

Shoe assembly is a labor-intensive process where adhesives are often applied manually. With Desmomelt® U, Covestro offers aliphatic hot melt adhesive raw materials that can be applied automatically via 2D digital printing. This means fewer processing steps and less waste without compromising quality.