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Redefining comfort in VR design
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Blaze: A breakthrough in thermal management for next-gen electronics

As VR devices become more powerful, internal heat management is essential for performance and comfort. Traditional cooling adds weight and complexity. The Blaze demonstrator provides a thermal solution that maintains efficiency, supports slim designs, and meets the demands of modern electronics.
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A new approach to heat management

Blaze redefines enclosure design with a passive and elegant approach to heat dispersion. Rather than relying on fans or other active cooling components, it uses a thermally conductive thin-wall structure made of Makrolon® TC to move heat from internal hotspots to the outer surface of the device. This enables sleek, compact devices to maintain high thermal performance without added bulk. 

Transformative impact across every dimension

Technical Performance
Blaze removes the need for traditional cooling components by dispersing heat through the enclosure itself. Its thin-wall design manages thermal loads effectively while preserving a clean, premium appearance. The result is lighter, more compact devices that deliver improved comfort and reliable performance.

Manufacturing Efficiency
Blaze simplifies assembly by reducing part count and material variety. It allows multiple functions to be integrated into fewer components, streamlining production, lowering system weight, and cutting costs.

Sustainability
The plastics featured in Blaze, Makrolon® TC and Bayblend®, are also available in more sustainable variants: RE variants with attributed biocircular materials and RP variants with attributed recycled post-consumer waste. With the use of recycled raw materials and a reduction in the number of materials needed for production, Blaze supports a lower carbon footprint across the product lifecycle. It advances responsible design without compromising durability, appearance, or performance.

Blaze improves user comfort by keeping devices cooler and lighter while helping manufacturers simplify production making next-generation electronics better for everyone.

Matt McKenna

Application Development, Americas, Covestro

The future of thermal design

Blaze is more than a cooling solution; it represents a new standard in how next-generation electronics are designed and experienced. By uniting thermal performance, visual elegance, manufacturing efficiency, and sustainability, Blaze delivers a forward-thinking approach to enclosure design. As the demand for compact and environmentally responsible devices continues to grow, Blaze offers a smart, scalable solution with thermal conductive Makrolon® TC polycarbonate that’s ready to meet the moment.

Jessica Gresko shows how Blaze manages heat in VR headsets to improve comfort and device design.
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Key benefits

  • Sleek design: Thin-wall design maintains sleek device aesthetics
  • Efficient cooling: Eliminates bulky fans and heat sinks by efficiently dispersing heat through the thermal conductive enclosure
  • Enhanced user comfort: Improves comfort through effective thermal management

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