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  • Adhesives

Dispercoll® U XP 2702

Anionic high-molecular-weight polyurethane dispersion. Dispercoll® U XP 2702 is an adhesive raw material for the formulation of thermally activated adhesives. It can be combined with deactivated IPDI trimers for the formulation of latent-reactive polyurethane dispersion adhesives. Dispercoll® U XP 2702 exhibits greater reactivity with the isocyanate groups of the IPDI trimer than does Dispercoll® U 56.

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About

Product Types

  • PU dispersion
  • PU dispersion - high molecular
  • Waterbased dispersion

Material

Adhesives
Fast bonding, Heat activated, Moisture resistant, Heat resistant, Waterborne

General Characterization

Anionic high-molecular-weight polyurethane dispersion.
Dispercoll® U XP 2702 is an adhesive raw material for the formulation of thermally activated adhesives. It can be combined with deactivated IPDI trimers for the formulation of latent-reactive polyurethane dispersion adhesives. Dispercoll® U XP 2702 exhibits greater reactivity with the isocyanate groups of the IPDI trimer than does Dispercoll® U 56.

Storage Conditions

- Storage in original sealed Covestro container.

- Recommended storage temperature: 5 - 23 °C, temperatures higher than
30 °C should be avoided.

- Protect from direct sunlight, moisture, heat and foreign material.

General information: The product is sensitive to frost. Freezing can damage the product irreversibly. Temperatures higher than 30 °C should be avoided. Prolonged storage at higher temperatures may affect the product properties and possibly resulting in sedimentation or coagulation. Containers must be kept sealed and protected from direct sunlight as otherwise the evaporation of water will result in the formation of a non-redispersible polymer film.

Sampling

No data available

Packaging Type

No data available

Technical Properties & Datasheets

Property Name Test Method Unit Value
Non-volatile content (1g / 1h / 125 °C) DIN EN ISO 3251 % 45 - 49
pH-value DIN ISO 976 6.0 - 9.0
Viscosity at 23 °C,spindle L 2 / 30 rpm DIN 53 019 mPa*s < 1,000

Property Name Test Method Unit Value
Minimum film-forming temperature DIN ISO 2115 °C approx. 5
Density at 23 °C DIN 51 757 g/cm3 approx. 1.1

Downloads

Technical Data Sheet
Download
Safety Data Sheet
No direct download available, please visit www.productsafetyfirst.covestro.com
Download

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